By John H. Lau
Proven second and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant second and 3D IC Interconnects bargains verified suggestions to reliability difficulties in lead-free interconnects for PCB meeting, traditional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative advisor offers the most recent state of the art reliability tools and knowledge for digital production prone (EMS) on second-level interconnects, packaging meeting on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. layout trustworthy 2nd and 3D IC interconnects in RoHS-compliant tasks utilizing the precise info during this useful resource.
Covers reliability of:
- 2D and 3D IC lead-free interconnects
- CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
- Lead-free (SACX) solder joints
- Low-temperature lead-free (SnBiAg) solder joints
- Solder joints with voids, excessive pressure expense, and excessive ramp rate
- VCSEL and LED lead-free interconnects
- 3D LED and 3D MEMS with TSVs
- Chip-to-wafer (C2W) bonding and lead-free interconnects
- Wafer-to-wafer (W2W) bonding and lead-free interconnects
- 3D IC chip stacking with low-temperature bonding
- TSV interposers and lead-free interconnects
- Electromigration of lead-free microbumps for 3D IC integration
Read or Download Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) PDF
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) by John H. Lau