Download e-book for iPad: 3D IC Integration and Packaging (Electronics) by John H. Lau

March 6, 2018 | Electrical Engineering | By admin | 0 Comments

By John H. Lau

A entire advisor to 3D IC integration and packaging technology

3D IC Integration and Packaging absolutely explains the most recent microelectronics strategies for expanding chip density and maximizing functionality whereas decreasing strength intake. in keeping with a path constructed via its writer, this useful consultant bargains real-world problem-solving tools and teaches the trade-offs inherent in making system-level judgements. discover key allowing applied sciences equivalent to TSV, thin-wafer power size and dealing with, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor photograph sensors integration. meeting, thermal administration, and reliability are coated in whole detail.
3D IC Integration and Packaging covers:
3D integration for semiconductor IC packaging
Through-silicon vias modeling and testing
Stress sensors for thin-wafer dealing with and energy measurement
Package substrate technologies
Microbump fabrication, meeting, and reliability
3D Si integration
2.5D/3D IC integration
3D IC integration with passive interposer
Thermal administration of 2.5D/3D IC integration
Embedded 3D hybrid integration
3D LED and IC integration
3D MEMS and IC integration
3D CMOS photo sensors and IC integration
PoP, chip-to-chip interconnects, and embedded fan-out WLP

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3D IC Integration and Packaging (Electronics) by John H. Lau


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